this is information on a product in full production. july 2013 docid024449 rev 1 1/10 stth1r04-y automotive ultrafast recovery diode datasheet - production data features ? negligible switching losses ? low forward and reverse recovery times ? high junction temperature ? aec-q101 qualified ? ecopack ? 2 compliant component description the stth1r04-y series uses st's new 400 v planar pt doping technology. specially suited for switching mode base drive and transistor circuits. packaged in surface mount packages, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection for all automotive application. table 1. device summary symbol value i f(av) 1 a v rrm 400 v t j (max) 175 c v f (typ) 0.9 v t rr (typ) 14 ns sma stth1r04ay smb STTH1R04UY k a k a www.st.com
characteristics stth1r04-y 2/10 docid024449 rev 1 1 characteristics to evaluate the conduction losses use the following equation: p = 0.9 x i f(av) + 0.250 x i f 2 (rms) table 2. absolute ratings (limiting values at 25 c, unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 400 v i f(av) average forward current, = 0.5 sma t lead = 130 c 1.0 a smb t lead = 140 c i fsm surge non repetitive forward current t p = 10 ms sinusoidal 30 a t stg storage temperature range -65 to +175 c t j operating junction temperature (1) 1. on infinite heatsink with 10 mm lead length -40 to 175 c table 3. thermal parameters symbol parameter value unit r th(j-l) junction to lead sma 30 c/w smb 25 table 4. static electrical characteristics symbol parameter test conditions min typ max unit i r (1) 1. pulse test: t p = 5 ms, < 2 % reverse leakage current t j = 25 c v r = v rrm 5 a t j = 125 c 5 50 v f (2) 2. pulse test: t p = 380 s, < 2 % forward voltage drop t j = 25 c i f = 1.0 a 1.6 v t j = 100 c 1.05 1.3 t j = 150 c 0.9 1.15
docid024449 rev 1 3/10 stth1r04-y characteristics 10 table 5. dynamic characteristics symbol parameter test conditions min typ max unit t rr reverse recovery time i f = 1 a, di f /dt = -50 a/s, v r = 30 v, t j = 25 c 30 ns i f = 1 a, di f /dt = -100 a/s, v r = 30 v, t j = 25 c 14 20 i rm reverse recovery current i f = 1 a, di f /dt = -200 a/s, v r = 320 v, t j = 125 c 2.5 3.5 a t fr forward recovery time i f = 1 a di f /dt = 100 a/s v fr = 1.1 x v fmax , t j = 25 c 50 ns v fp forward recovery voltage i f = 1 a, di f /dt = 100 a/s, t j = 25 c 2.9 v figure 1. conduction losses versus average forward current figure 2. forward voltage drop versus forward current 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.0 0.2 0.4 0.6 0.8 1.0 1.2 p(w ) =0.05 =0.1 =0.2 =0.5 =1 t =tp/t tp i f(av) (a) i fm (a) 0.1 1.0 10.0 100.0 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4 t j =150c (maximum values) t j =150c (typical values) t j =25c (maximum values) v fm (v) figure 3. relative variation of thermal impedance junction to ambient versus pulse duration, sma figure 4. relative variation of thermal impedance junction to ambient versus pulse duration, smb 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 single pulse sma s cu = 1cm2 z/r th (j-a) th(j-a) t p (s) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 single pulse t p (s) z/r th (j-a) th(j-a) smb s = 1 cm cu
characteristics stth1r04-y 4/10 docid024449 rev 1 figure 5. junction capacitance versus reverse voltage applied (typical values) figure 6. reverse recovery charges versus di f /dt (typical values) 1 10 100 1 10 100 1000 c(pf) f=1mhz v osc =30mv rms t j =25c v r (v) 0 4 8 12 16 20 24 28 32 36 40 10 100 1000 q rr (nc) i f = 1 a v r =320 v t j =125 c t j =25 c di f /dt(a/s) figure 7. reverse recovery time versus di f /dt (typical values) figure 8. peak reverse recovery current versus di f /dt (typical values) 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 10 100 1000 t rr (ns) i f = 1 a v r =320 v t j =125 c t j =25 c di f /dt(a/s) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 10 100 1000 i rm (a) i f = 1 a v r =320 v t j =125 c t j =25 c di f /dt(a/s) figure 9. relative variations of dynamic parameters versus junction temperature figure 10. transient peak forward voltage versus di f /dt (typical values) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 25 50 75 100 125 150 q rr ;i rm [t j ]/q rr ;i rm [t j =125c] i rm q rr i f = 1 a v r =320 v t j (c) q rr ;i rm [t j ]/q rr ;i rm [t j =125c] 0 5 10 15 20 25 30 0 50 100 150 200 250 300 350 400 450 500 v fp (v) i f =1 a t j =125 c di f /dt(a/s)
docid024449 rev 1 5/10 stth1r04-y characteristics 10 figure 13. thermal resistance junction to ambient versus copper surface under each lead figure 11. forward recovery time versus di f /dt (typical values) figure 12. thermal resistance junction to ambient versus copper surface under each lead 0 5 10 15 20 25 30 35 40 45 50 55 0 50 100 150 200 250 300 350 400 450 500 t fr (ns) i f =1 a t j =125 c di f /dt(a/s) r th(j-a) (c/w) 0 50 100 150 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 s cu (cm2) sma epoxy printed board fr4, copper thickness cu = 35 m r th(j-a) (c/w) 0 50 100 150 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 smb s cu (cm2) epoxy printed board fr4, copper thickness cu = 35 m
package information stth1r04-y 6/10 docid024449 rev 1 2 package information ? epoxy meets ul94, v0 ? lead-free package ? cooling method: by conduction (c) in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 14. smb dimension definitions e c l e1 d a1 a2 b
docid024449 rev 1 7/10 stth1r04-y package information 10 figure 15. smb footprint, dimensions in mm (inches) table 6. smb dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 d 3.30 3.95 0.130 0.156 e 5.10 5.60 0.201 0.220 e1 4.05 4.60 0.159 0.181 l 0.75 1.50 0.030 0.059 2.60 5.84 1.62 2.18 1.62 (0.064) (0.102) (0.23) (0.064) (0.086)
package information stth1r04-y 8/10 docid024449 rev 1 figure 16. sma dimension definitions figure 17. sma footprint, dimensions in mm (inches) table 7. sma dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a1 1.90 2.45 0.075 0.094 a2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 d 2.25 2.90 0.089 0.114 e 4.80 5.35 0.189 0.211 e1 3.95 4.60 0.156 0.181 l 0.75 1.50 0.030 0.059 e c l e1 d a1 a2 b 2.63 (0.104) 5.43 (0.214) 1.4 1.64 (0.064) 1.4 (0.055) (0.055)
docid024449 rev 1 9/10 stth1r04-y ordering information 10 3 ordering information 4 revision history table 8. ordering information order code marking package weight base qty delivery mode stth1r04ay hr4y sma 0.068 g 5000 tape and reel STTH1R04UY br4y smb 0.12 g 2500 tape and reel table 9. document revision history date revision description of changes 09-jul-2013 1 first issue
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